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Suzhou Sail Science & Technology Co., Ltd.

 
 
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Best quality latest back grinding diamond wheels for silicon wafer 

  Category : Machinery on-line->Printing Machine->printer

     
Best quality latest back grinding diamond wheels for silicon wafer
       

  Product Specification
 
  Model No:      SD2000N125
  Country  CN
  Brand  Sail-tech
  Packing  Bags or Cartons
  Minimum Order  30
  Payment Term  T/T

 

    Product Detail
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<img src="http://i.bosscdn.com/product/cd/51/43/647754d67634727708cda1365c.jpg@watermark=2&color=I0ZGRkZGRg%3D%3D&type=ZHJvaWRzYW5zZmFsbGJhY2s%3D&size=20&p=1&t=80&text=c2FpbGFicmFzaXZlcy5ib3NzZ29vLmNvbQ%3D%3D" title="Grinding Wheels" alt="Grinding Wheels" />
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Resin Bond Blade
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Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What<span>`</span><span>s more, we can provide customers service for different specifications and types according their needs.</span>
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Product characteristics
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1. new bond will be developed according to processing materials ;
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2. customer can customize blades of different specifications and work performance
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3. New hot pressing molding technology ensures product quality stability
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Processing objects
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QFN<span>.</span><span>optical glass</span><span>.</span><span>ceramic materials ect.</span>
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</p>sail-abrasives.com

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