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Suzhou Sail Science & Technology Co., Ltd.

 
 
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1A8 Resin Bond Dicing Blade for Semiconductor Component, Diamond Cutting Wheel 

  Category : Sports and leisure->Game->Child's Game Tool

     
1A8 Resin Bond Dicing Blade for Semiconductor Component, Diamond Cutting Wheel
       

  Product Specification
 
  Model No:      B1A8
  Country  CN
  Brand  SAIL-TECH
  Packing  Bags or Cartons
  Minimum Order  10
  Payment Term  L/C,T/T

 

    Product Detail
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Vaccum
Brazed diamond saw blade
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Resin Bond Blade
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Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What<span>`</span><span>s more, we can provide customers service for different specifications and types according their needs.</span>
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Product characteristics
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1. new bond will be developed according to processing materials ;
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2. customer can customize blades of different specifications and work performance
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3. New hot pressing molding technology ensures product quality stability
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&nbsp;<img src="http://i.bosscdn.com/product/8f/9f/9c/8fca2c82d810799a837a08ba9f.jpg@watermark=2&color=I0ZGRkZGRg%3D%3D&type=ZHJvaWRzYW5zZmFsbGJhY2s%3D&size=20&p=9&t=80&text=c2FpbGFicmFzaXZlcy5ib3NzZ29vLmNvbQ%3D%3D" title="8fca2c82d810799a837a08ba9f" alt="8fca2c82d810799a837a08ba9f" /><span style="line-height:1.5;">Processing objects</span>
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QFN<span>.</span><span>optical glass</span><span>.</span><span>ceramic materials ect.</span>
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Features:
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1.Long
life and stable performance
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2.Good
cutting result and high efficiency
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3.Produce
all kinds of specifications
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4.Any
package upon request
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5.Delivery
on time
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6.Accept
small quantity orders
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</div>sail-abrasives.com

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Metal-bond Dicing Blade for BGA
 
   


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