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Suzhou Sail Science & Technology Co., Ltd.

 
 
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Silicon Wafer Back Grinding Wheel 

  Category : Machinery on-line->Printing Machine->printer

     
Silicon Wafer Back Grinding Wheel
       

  Product Specification
 
  Model No:      SD1000V03
  Country  CN
  Brand  SAIL-TECH
  Packing  Bags or Cartons
  Minimum Order  100
  Payment Term  T/T

 

    Product Detail
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<span style="font-style:inherit;font-weight:inherit;font-size:32px;line-height:48px;font-family:inherit;vertical-align:baseline;color:#003300;"><span style="font-weight:700;">Silicon Wafer Back Grinding Wheel</span></span>
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<span style="font-style:inherit;font-weight:inherit;font-size:24px;line-height:36px;font-family:inherit;vertical-align:baseline;color:#003300;">Silicon wafer back geinding wheel are used for trimming of silicon wafers.our back grinding wheels are designed used on Janpan,Germany and China-made geinders.</span>
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</span><span style="font-family:NSimSun;font-size:32px;line-height:1.5;">The Metal-bond wheels are mainly used for back thinning of sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer.This Kind of grinding wheel developed in our company can replace imported products.</span>
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<span style="font-family:NSimSun;font-style:inherit;font-weight:inherit;font-size:32px;">Material of workpieces:</span>
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<span style="font-family:NSimSun;font-size:32px;">Sapphire epitaxial wafer,silicon wafer,gallium arsenide and GaN wafer</span>
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<img src="http://i.bosscdn.com/product/03/c1/e2/0d8daf65825fa9a6b24d064112.png@watermark=2&color=I0ZGRkZGRg%3D%3D&type=ZHJvaWRzYW5zZmFsbGJhY2s%3D&size=20&p=9&t=80&text=c2FpbGFicmFzaXZlcy5ib3NzZ29vLmNvbQ%3D%3D" title="Grinding Wheels" alt="Grinding Wheels" />
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</p>sail-abrasives.com

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